Numerical investigations on the effects of different cooling periods in reflow-soldering process

Investigation of radiation models in entrained-flow coal gasification simulation

(2013) Xijia Lu et al.   INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey‐based Taguchi method

(2013) Chun‐Sean Lau et al.   MICROELECTRONICS INTERNATIONAL

Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys

(2013) S. Chavali et al.   MICROELECTRONICS RELIABILITY

Evaluation of various turbulence models for the prediction of the airflow and temperature distributions in atria

(2012) Shafqat Hussain et al.   ENERGY AND BUILDINGS

Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method

(2012) Chun-Sean Lau et al.   MICROELECTRONICS RELIABILITY

Three‐dimensional thermal investigations at board level in a reflow oven using thermal‐coupling method

(2012) Chun‐Sean Lau et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process

(2012) Chun‐Sean Lau et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Application of CFD Simulation in the Development of a New Generation Heating Oven

(2012) Zlatko Rek et al.   STROJNISKI VESTNIK-JOURNAL OF MECHANICAL ENGINEERING

Computational fluid dynamics (CFD) modeling of an electrical heating oven for bread-baking process

(2010) N. Chhanwal et al.   JOURNAL OF FOOD ENGINEERING

Influences on the reflow soldering process by components with specific thermal properties

(2009) Florian Schüßler et al.   CIRCUIT WORLD

Thermal profiling: a reflow process based on the heating factor

(2008) Jin Gang Gao et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY