Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders

Published 2008 View Full Article

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Title
Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders
Authors
Keywords
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Journal
MATERIALS TRANSACTIONS
Volume 49, Issue 5, Pages 1175-1179
Publisher
Japan Institute of Metals
Online
2008-04-25
DOI
10.2320/matertrans.mbw200705

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