Conformal Hermetic Sealing of Wireless Microelectronic Implantable Chiplets by Multilayered Atomic Layer Deposition (ALD)

Title
Conformal Hermetic Sealing of Wireless Microelectronic Implantable Chiplets by Multilayered Atomic Layer Deposition (ALD)
Authors
Keywords
-
Journal
ADVANCED FUNCTIONAL MATERIALS
Volume -, Issue -, Pages 1806440
Publisher
Wiley
Online
2018-12-13
DOI
10.1002/adfm.201806440

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