Conformal Hermetic Sealing of Wireless Microelectronic Implantable Chiplets by Multilayered Atomic Layer Deposition (ALD)
出版年份 2018 全文链接
标题
Conformal Hermetic Sealing of Wireless Microelectronic Implantable Chiplets by Multilayered Atomic Layer Deposition (ALD)
作者
关键词
-
出版物
ADVANCED FUNCTIONAL MATERIALS
Volume -, Issue -, Pages 1806440
出版商
Wiley
发表日期
2018-12-13
DOI
10.1002/adfm.201806440
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