Parylene Interposer as Thin Flexible 3-D Packaging Enabler for Wireless Applications

OpenPET: A Flexible Electronics System for Radiotracer Imaging

(2010) W. W. Moses et al.   IEEE TRANSACTIONS ON NUCLEAR SCIENCE

Wafer-Level Parylene Packaging With Integrated RF Electronics for Wireless Retinal Prostheses

(2010) Wen Li et al.   JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

3-D CMOS Circuits Based on Low-Loss Vertical Interconnects on Parylene-N

(2009) R.R. Lahiji et al.   IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES

Carbon Nanotube Reinforced Conductors for Flexible Electronics

(2009) Jeff Tsung Hui Tsai et al.   Journal of Display Technology

A Parylene Bellows Electrochemical Actuator

(2009) Po-Ying Li et al.   JOURNAL OF MICROELECTROMECHANICAL SYSTEMS

Development of 3-D Stack Package Using Silicon Interposer for High-Power Application

(2008) Navas Khan et al.   IEEE TRANSACTIONS ON ADVANCED PACKAGING

Encapsulation of an Integrated Neural Interface Device With Parylene C

(2008) Jui-Mei Hsu et al.   IEEE TRANSACTIONS ON BIOMEDICAL ENGINEERING

Microfabricated Implantable Parylene-Based Wireless Passive Intraocular Pressure Sensors

(2008) Po-Jui Chen et al.   JOURNAL OF MICROELECTROMECHANICAL SYSTEMS