Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5 IMC growth at anode side Cu/Sn interface
出版年份 2020 全文链接
标题
Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5 IMC growth at anode side Cu/Sn interface
作者
关键词
Phase field method, Artificial neural network, Intermetallic compound, Current density, Synchrotron radiation
出版物
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
Volume 59, Issue -, Pages 203-219
出版商
Elsevier BV
发表日期
2020-06-20
DOI
10.1016/j.jmst.2020.04.046
参考文献
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- (2020) Zhan Liu et al. ACS Applied Materials & Interfaces
- Phase-field study of IMC growth in Sn–Cu/Cu solder joints including elastoplastic effects
- (2020) A. Durga et al. ACTA MATERIALIA
- Multiphase-field modelling of concurrent grain growth and coarsening in complex multicomponent systems
- (2020) P.G. Kubendran Amos et al. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
- Growth of intermetallic compounds in solder joints based on strongly coupled thermo–mechano–electro–diffusional theory
- (2020) Zhao Zhipeng et al. MICROELECTRONICS RELIABILITY
- A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering
- (2020) Anil Kunwar et al. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
- Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint
- (2019) Shengyan Shang et al. MICROELECTRONIC ENGINEERING
- A novel electromigration characterization method based on low-frequency noise measurements
- (2019) Sofie Beyne et al. SEMICONDUCTOR SCIENCE AND TECHNOLOGY
- An Artificial Neural Network Model to Predict the Thermal Properties of Concrete Using Different Neurons and Activation Functions
- (2019) Sehmus Fidan et al. Advances in Materials Science and Engineering
- A method for simulating the influence of grain boundaries and material interfaces on electromigration
- (2019) Lado Filipovic MICROELECTRONICS RELIABILITY
- A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production
- (2019) K. N. Tu et al. JOURNAL OF APPLIED PHYSICS
- Role of conductivity on the electromigration-induced morphological evolution of inclusions in {110}-oriented single crystal metallic thin films
- (2019) Jay Santoki et al. JOURNAL OF APPLIED PHYSICS
- Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering
- (2019) Lin Hou et al. Scientific Reports
- How to apply the phase field method to model radiation damage
- (2018) Michael R. Tonks et al. COMPUTATIONAL MATERIALS SCIENCE
- Intermetallic Growth Induced Large-Scale Void Growth and Cracking Failure in Line-Type Cu/Solder/Cu Joints Under Current Stressing
- (2018) Zhuo Chen et al. JOURNAL OF ELECTRONIC MATERIALS
- Studies of Interfacial Microstructures and Series Resistance on Electroplated and Hot-Dipped Sn-xCu Photovoltaic Modules
- (2018) Kuan-Jen Chen et al. JOURNAL OF ELECTRONIC MATERIALS
- Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current
- (2018) Jiayun Feng et al. Scientific Reports
- On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjoints
- (2018) Vahid Attari et al. ACTA MATERIALIA
- Phase-Field Study of Electromigration-Induced Shape Evolution of a Transgranular Finger-Like Slit
- (2018) Jay Santoki et al. JOURNAL OF ELECTRONIC MATERIALS
- Effect of the TiO2 Nanoparticles on the Growth Behavior of Intermetallics in Sn/Cu Solder Joints
- (2018) Shengyan Shang et al. METALS AND MATERIALS INTERNATIONAL
- Optimization of an Artificial Neural Network System for the Prediction of Failure Analysis Success
- (2018) Lin Zhao et al. MICROELECTRONICS RELIABILITY
- Using deep neural network with small dataset to predict material defects
- (2018) Shuo Feng et al. MATERIALS & DESIGN
- A Multiparameter Numerical Modeling and Simulation of the Dipping Process in Microelectronics Packaging
- (2018) Junhui Li et al. IEEE Transactions on Industrial Informatics
- Ultrafast formation of unidirectional and reliable Cu3Sn-based intermetallic joints assisted by electric current
- (2017) Baolei Liu et al. INTERMETALLICS
- Coupled diffusion-deformation multiphase field model for elastoplastic materials applied to the growth of Cu 6 Sn 5
- (2016) Johan Hektor et al. ACTA MATERIALIA
- New Applications of an Automated System for High-Power LEDs
- (2016) Junhui Li et al. IEEE-ASME TRANSACTIONS ON MECHATRONICS
- Influence of the solubility range of intermetallic compounds on their growth behavior in hetero-junctions
- (2015) Y. Guan et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Migration behavior of indium atoms in Cu/Sn–52In/Cu interconnects during electromigration
- (2015) Mingliang Huang et al. JOURNAL OF MATERIALS RESEARCH
- In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper
- (2015) Haitao Ma et al. SCRIPTA MATERIALIA
- In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Soldering Process
- (2014) Lin Qu et al. JOURNAL OF ELECTRONIC MATERIALS
- Phase-field simulations of intermetallic compound evolution in Cu/Sn solder joints under electromigration
- (2013) M.S. Park et al. ACTA MATERIALIA
- A Quantitative Analysis of Photovoltaic Modules Using Halved Cells
- (2013) S. Guo et al. INTERNATIONAL JOURNAL OF PHOTOENERGY
- Modeling of thermotransport phenomenon in metal alloys using artificial neural networks
- (2012) Seshasai Srinivasan et al. APPLIED MATHEMATICAL MODELLING
- An object-oriented finite element framework for multiphysics phase field simulations
- (2011) Michael R. Tonks et al. COMPUTATIONAL MATERIALS SCIENCE
- A Diffuse Interface Model of Intermediate-Phase Growth Under the Influence of Electromigration
- (2011) Peng Zhou et al. JOURNAL OF ELECTRONIC MATERIALS
- Early stages of intermetallic compound formation and growth during lead-free soldering
- (2010) M.S. Park et al. ACTA MATERIALIA
- A quantitative and thermodynamically consistent phase-field interpolation function for multi-phase systems
- (2010) Nele Moelans ACTA MATERIALIA
- MOOSE: A parallel computational framework for coupled systems of nonlinear equations
- (2009) Derek Gaston et al. NUCLEAR ENGINEERING AND DESIGN
- Quantitative analysis of grain boundary properties in a generalized phase field model for grain growth in anisotropic systems
- (2008) N. Moelans et al. PHYSICAL REVIEW B
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