A method for simulating the influence of grain boundaries and material interfaces on electromigration

出版年份 2019 全文链接

标题

作者

关键词

Electromigration, Modeling and simulation, TCAD, Nano-interconnects, Copper, Back-end-of-line, Reliability

出版物

Volume 97, Issue -, Pages 38-52

出版商

Elsevier BV

发表日期

2019-05-03

DOI

10.1016/j.microrel.2019.04.005

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