Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering

The Thermodynamic Assessment of the Co-Sn System

(2018) V. Jedličková et al.   JOURNAL OF PHASE EQUILIBRIA AND DIFFUSION

Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter

(2016) Yingxia Liu et al.   ACTA MATERIALIA

Investigation of diffusion behavior in Cu–Sn solid state diffusion couples

(2016) Yuan Yuan et al.   JOURNAL OF ALLOYS AND COMPOUNDS

The effects of Sn solder grain size on the morphology and evolution of Cu6Sn5 in the aging process

(2016) Zhangjian Zhao et al.   MATERIALS LETTERS

Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects

(2016) Pay Chia et al.   Materials

Influence of the solubility range of intermetallic compounds on their growth behavior in hetero-junctions

(2015) Y. Guan et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Formation, processing and characterization of Co–Sn intermetallic compounds for potential integration in 3D interconnects

(2015) George Vakanas et al.   MICROELECTRONIC ENGINEERING

Kinetics of Solid-State Reactive Diffusion between Co and Sn

(2014) Minho O et al.   MATERIALS TRANSACTIONS

Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on 〈111〉 oriented and nanotwinned Cu

(2013) Han-wen Lin et al.   ACTA MATERIALIA

Modelling of phase diagrams and thermodynamic properties using Calphad method – Development of thermodynamic databases

(2012) Ales Kroupa   COMPUTATIONAL MATERIALS SCIENCE

Temperature effects on liquid-state Sn/Co interfacial reactions

(2012) Chao-hong Wang et al.   INTERMETALLICS

A phase field model for isothermal crystallization of oxide melts

(2011) J. Heulens et al.   ACTA MATERIALIA

Computational investigation of intermetallic compounds (Cu6Sn5 and Cu3Sn) growth during solid-state aging process

(2011) M.S. Park et al.   COMPUTATIONAL MATERIALS SCIENCE

A quantitative and thermodynamically consistent phase-field interpolation function for multi-phase systems

(2010) Nele Moelans   ACTA MATERIALIA

A Commentary on “Diffusion, Mobility and Their Interrelation through Free Energy in Binary Metallic Systems,” L.S. Darken: Trans. AIME, 1948, vol. 175, p. 184ff

(2010) Seetharaman Sridhar   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Kirkendall voids in the intermetallic layers of solder joints in MEMS

(2008) Kerstin Weinberg et al.   COMPUTATIONAL MATERIALS SCIENCE

Sn/Co solid/solid interfacial reactions

(2008) Chao-hong Wang et al.   INTERMETALLICS

Interaction behavior between the additives and Sn in Sn–3.0Ag–0.5Cu-based solder alloys and the relevant joint solderability

(2008) Fangjie Cheng et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Quantitative Phase-Field Approach for Simulating Grain Growth in Anisotropic Systems with Arbitrary Inclination and Misorientation Dependence

(2008) N. Moelans et al.   PHYSICAL REVIEW LETTERS

An introduction to phase-field modeling of microstructure evolution

(2007) Nele Moelans et al.   CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY

Formation of intermetallic compound (IMC) between Sn and Co substrate

(2007) WenJun Zhu et al.   JOURNAL OF ALLOYS AND COMPOUNDS