Influence of the solubility range of intermetallic compounds on their growth behavior in hetero-junctions

出版年份 2015 全文链接

标题

作者

关键词

Solubility, Intermetallic compounds, Growth kinetics, Cu, 3, Sn, Cu, 6, Sn, 5

出版物

Volume 635, Issue -, Pages 289-299

出版商

Elsevier BV

发表日期

2015-02-17

DOI

10.1016/j.jallcom.2015.02.028

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