Studies of Interfacial Microstructures and Series Resistance on Electroplated and Hot-Dipped Sn-xCu Photovoltaic Modules

A study of green Sn–xZn photovoltaic ribbons for solar cell application

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Microstructure and electrical mechanism of Sn–xAg–Cu PV-ribbon for solar cells

(2013) Kuan-Jen Chen et al.   MICROELECTRONIC ENGINEERING

Electrical transport properties of Ag3Sn compound

(2011) Yong Tian et al.   SOLID STATE COMMUNICATIONS

Formation and Growth of Intermetallic Compound Cu6Sn5 at Early Stages in Lead-Free Soldering

(2010) M.S. Park et al.   JOURNAL OF ELECTRONIC MATERIALS

Production of 122Sb for the study of environmental pollution

(2010) Mahdi Sadeghi et al.   JOURNAL OF RADIOANALYTICAL AND NUCLEAR CHEMISTRY

Durability of Pb-free solder between copper interconnect and silicon in photovoltaic cells

(2010) Gayatri Cuddalorepatta et al.   PROGRESS IN PHOTOVOLTAICS

Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders

(2009) N. Zhao et al.   JOURNAL OF ELECTRONIC MATERIALS

Growth kinetics of intermetallic compounds and tensile properties of Sn–Ag–Cu/Ag single crystal joint

(2007) Hefei Zou et al.   JOURNAL OF ALLOYS AND COMPOUNDS