Intermetallic Growth Induced Large-Scale Void Growth and Cracking Failure in Line-Type Cu/Solder/Cu Joints Under Current Stressing

Electromigration in 3D-IC scale Cu/Sn/Cu solder joints

(2016) Cheng-En Ho et al.   JOURNAL OF ALLOYS AND COMPOUNDS

In Situ Electromigration in Cu-Sn and Ni-Sn Critical Solder Length for Three-Dimensional Integrated Circuits

(2016) Y. T. Huang et al.   JOURNAL OF ELECTRONIC MATERIALS

Microstructural and mechanical analysis on Cu–Sn intermetallic micro-joints under isothermal condition

(2015) L. Mo et al.   INTERMETALLICS

Fine pitch Cu/Sn solid state diffusion bonding for advanced three-dimensional chip stacking

(2015) Wenqi Zhang   JAPANESE JOURNAL OF APPLIED PHYSICS

Electromigration induced Kirkendall void growth in Sn-3.5Ag/Cu solder joints

(2014) Yong Jung et al.   JOURNAL OF APPLIED PHYSICS

Serrated cathode dissolution under high current density: Morphology and root cause

(2013) T. L. Yang et al.   JOURNAL OF APPLIED PHYSICS

Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging

(2013) Hao Hsu et al.   JOURNAL OF ELECTRONIC MATERIALS

Intermetallic compound layer growth between SnAgCu solder and Cu substrate in electronic packaging

(2013) Liang Zhang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing

(2012) J.H. Ke et al.   ACTA MATERIALIA

Electromigration induced failure on lead-free micro bumps in three-dimensional integrated circuits packaging

(2012) Fan-Yi Ouyang et al.   JOURNAL OF APPLIED PHYSICS

Interdiffusion at the interface between Sn-based solders and Cu substrate

(2012) Yang Yang et al.   MICROELECTRONICS RELIABILITY

Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing

(2011) J.H. Ke et al.   ACTA MATERIALIA

Void formation at the interface in Sn/Cu solder joints

(2011) Yang Yang et al.   MICROELECTRONICS RELIABILITY

Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect

(2010) L.D. Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps

(2010) Myeong-Hyeok Jeong et al.   JOURNAL OF ELECTRONIC MATERIALS

Effects of Bonding Temperature and Pressure on the Electrical Resistance of Cu/Sn/Cu Joints for 3D Integration Applications

(2010) Byunghoon Lee et al.   JOURNAL OF ELECTRONIC MATERIALS

Reliability challenges in 3D IC packaging technology

(2010) K.N. Tu   MICROELECTRONICS RELIABILITY

Electromigration effect on pancake type void propagation near the interface of bulk solder and intermetallic compound

(2009) Yao Yao et al.   JOURNAL OF APPLIED PHYSICS