Phase-Field Study of Electromigration-Induced Shape Evolution of a Transgranular Finger-Like Slit
出版年份 2018 全文链接
标题
Phase-Field Study of Electromigration-Induced Shape Evolution of a Transgranular Finger-Like Slit
作者
关键词
Electromigration, finger-like slit, void propagation, phase-field model, solder joints
出版物
JOURNAL OF ELECTRONIC MATERIALS
Volume -, Issue -, Pages -
出版商
Springer Nature America, Inc
发表日期
2018-08-31
DOI
10.1007/s11664-018-6619-5
参考文献
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