Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current
出版年份 2018 全文链接
标题
Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current
作者
关键词
-
出版物
Scientific Reports
Volume 8, Issue 1, Pages -
出版商
Springer Nature
发表日期
2018-01-23
DOI
10.1038/s41598-018-20100-1
参考文献
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注意:仅列出部分参考文献,下载原文获取全部文献信息。- On the initial stages of phase formation at the solid Cu/liquid Sn-based solder interface
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