In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Soldering Process

A synchrotron radiation real-time in situ imaging study on the reverse polarity effect in Cu/Sn–9Zn/Cu interconnect during liquid–solid electromigration

(2013) M.L. Huang et al.   SCRIPTA MATERIALIA

In situ study of the real-time growth behavior of Cu6Sn5 at the Sn/Cu interface during the soldering reaction

(2013) L. Qu et al.   SCRIPTA MATERIALIA

In-situ study on growth behavior of Ag3Sn in Sn–3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology

(2012) H.T. Ma et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Evolution of dendrite morphology of a binary alloy under an applied electric current: Anin situobservation

(2010) Tongmin Wang et al.   PHYSICAL REVIEW E

The growth kinetics of intermetallic layers at the interface of a solid metal and a liquid solder

(2009) V. I. Dybkov   JOM

Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations

(2008) Aditya Kumar et al.   JOURNAL OF ELECTRONIC MATERIALS

Pronounced electromigration of Cu in molten Sn-based solders

(2008) J.R. Huang et al.   JOURNAL OF MATERIALS RESEARCH