On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjoints

出版年份 2018 全文链接

标题

On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjoints

作者

关键词

-

出版物

ACTA MATERIALIA

Volume 160, Issue -, Pages 185-198

出版商

Elsevier BV

发表日期

2018-09-01

DOI

10.1016/j.actamat.2018.08.049

向作者/读者发起求助以获取更多资源

Protocol

Reagent

Reprint

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

© Peeref 2019-2024. All rights reserved.