Phase-field simulations of intermetallic compound evolution in Cu/Sn solder joints under electromigration

标题
Phase-field simulations of intermetallic compound evolution in Cu/Sn solder joints under electromigration
作者
关键词
-
出版物
ACTA MATERIALIA
Volume 61, Issue 19, Pages 7142-7154
出版商
Elsevier BV
发表日期
2013-09-13
DOI
10.1016/j.actamat.2013.08.016

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