A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering

标题
A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering
作者
关键词
Intermetallic compound, Neural network, Finite element method (FEM), Laser parameters, Lead-free solders, Morphology
出版物
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
Volume 50, Issue -, Pages 115-127
出版商
Elsevier BV
发表日期
2020-03-08
DOI
10.1016/j.jmst.2019.12.036

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