Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint

出版年份 2019 全文链接

标题

作者

关键词

Finite element analysis, Intermetallics, Hardness, Soldering, Scanning electron microscopy, Nanoparticles

出版物

Volume 208, Issue -, Pages 47-53

出版商

Elsevier BV

发表日期

2019-02-10

DOI

10.1016/j.mee.2019.01.009

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