Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate

Published 2008 View Full Article

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Title
Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate
Authors
Keywords
-
Journal
ACTA MATERIALIA
Volume 56, Issue 16, Pages 4291-4297
Publisher
Elsevier BV
Online
2008-06-06
DOI
10.1016/j.actamat.2008.04.063

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