Mechanical properties of Sn–Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology

Title
Mechanical properties of Sn–Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology
Authors
Keywords
-
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 562, Issue -, Pages 194-204
Publisher
Elsevier BV
Online
2013-02-21
DOI
10.1016/j.jallcom.2013.02.050

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