Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates
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Title
Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates
Authors
Keywords
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Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 29, Issue 15, Pages 13167-13175
Publisher
Springer Nature
Online
2018-06-09
DOI
10.1007/s10854-018-9440-2
References
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Note: Only part of the references are listed.- Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
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