Effect of Pr addition on properties and Sn whisker growth of Sn–0.3Ag–0.7Cu low-Ag solder for electronic packaging
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Title
Effect of Pr addition on properties and Sn whisker growth of Sn–0.3Ag–0.7Cu low-Ag solder for electronic packaging
Authors
Keywords
Wettability, Solder Joint, Soldering Temperature, Solder Matrix, Molten Solder
Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 28, Issue 14, Pages 10230-10244
Publisher
Springer Nature
Online
2017-03-28
DOI
10.1007/s10854-017-6790-0
References
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- (2008) Hongqin Wang et al. JOURNAL OF ELECTRONIC MATERIALS
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