Numerical and experimental study on laser soldering process of SnAgCu lead-free solder
出版年份 2021 全文链接
标题
Numerical and experimental study on laser soldering process of SnAgCu lead-free solder
作者
关键词
SnAgCu solder, Laser soldering processing parameters, Microstructure, Temperature distribution, Thermal stress and deformation
出版物
MATERIALS CHEMISTRY AND PHYSICS
Volume 273, Issue -, Pages 125046
出版商
Elsevier BV
发表日期
2021-07-26
DOI
10.1016/j.matchemphys.2021.125046
参考文献
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