Improved chemical mechanical polishing performance in 4H-SiC substrate by combining novel mixed abrasive slurry and photocatalytic effect
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Title
Improved chemical mechanical polishing performance in 4H-SiC substrate by combining novel mixed abrasive slurry and photocatalytic effect
Authors
Keywords
Silicon carbide (SiC), Chemical mechanical polishing (CMP), Mixed abrasive slurry (MAS), Photocatalysis, High-energy ball milling (HEBM)
Journal
APPLIED SURFACE SCIENCE
Volume 575, Issue -, Pages 151676
Publisher
Elsevier BV
Online
2021-10-29
DOI
10.1016/j.apsusc.2021.151676
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