Fabrication of high-quality GaAs/diamond heterointerface for thermal management applications
Published 2020 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
Fabrication of high-quality GaAs/diamond heterointerface for thermal management applications
Authors
Keywords
GaAs/diamond bonding interface, Interfacial structure, Heterointerface, Direct bonding, Power devices, Heat sink
Journal
DIAMOND AND RELATED MATERIALS
Volume 111, Issue -, Pages 108207
Publisher
Elsevier BV
Online
2020-11-28
DOI
10.1016/j.diamond.2020.108207
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- Low-temperature direct bonding of β-Ga2O3 and diamond substrates under atmospheric conditions
- (2020) Takashi Matsumae et al. APPLIED PHYSICS LETTERS
- Chemical bonding at room temperature via surface activation to fabricate low-resistance GaAs/Si heterointerfaces
- (2020) Yutaka Ohno et al. APPLIED SURFACE SCIENCE
- Annealing effect of surface-activated bonded diamond/Si interface
- (2019) Jianbo Liang et al. DIAMOND AND RELATED MATERIALS
- Optical AND operation in n-AlGaAs/GaAs heterojunction field effect transistor
- (2018) T. Kawazu et al. APPLIED PHYSICS LETTERS
- Room temperature GaN-diamond bonding for high-power GaN-on-diamond devices
- (2018) Fengwen Mu et al. SCRIPTA MATERIALIA
- Stability of diamond/Si bonding interface during device fabrication process
- (2018) Jianbo Liang et al. Applied Physics Express
- Hard X-ray photoelectron spectroscopy investigation of annealing effects on buried oxide in GaAs/Si junctions by surface-activated bonding
- (2018) Shoji Yamajo et al. APPLIED SURFACE SCIENCE
- Intrinsic microstructure of Si/GaAs heterointerfaces fabricated by surface-activated bonding at room temperature
- (2017) Yutaka Ohno et al. JAPANESE JOURNAL OF APPLIED PHYSICS
- Improved thermal management of InP transistors in transferred-substrate technology with diamond heat-spreading layer
- (2015) K. Nosaeva et al. ELECTRONICS LETTERS
- Surface activated bonding of GaAs and SiC wafers at room temperature for improved heat dissipation in high-power semiconductor lasers
- (2015) Eiji Higurashi et al. JAPANESE JOURNAL OF APPLIED PHYSICS
- Effects of thermal annealing process on the electrical properties of p+-Si/n-SiC heterojunctions
- (2014) J. Liang et al. APPLIED PHYSICS LETTERS
- Electrical Properties of p-Si/n-GaAs Heterojunctions by Using Surface-Activated Bonding
- (2013) Jianbo Liang et al. Applied Physics Express
- Electrical properties of Si/Si interfaces by using surface-activated bonding
- (2013) J. Liang et al. JOURNAL OF APPLIED PHYSICS
- AlGaN/GaN high-electron mobility transistors with low thermal resistance grown on single-crystal diamond (111) substrates by metalorganic vapor-phase epitaxy
- (2011) Kazuyuki Hirama et al. APPLIED PHYSICS LETTERS
- Microscopy and Electrical Properties of Ge/Ge Interfaces Bonded by Surface-Activated Wafer Bonding Technology
- (2011) Kentaroh Watanabe et al. JAPANESE JOURNAL OF APPLIED PHYSICS
Discover Peeref hubs
Discuss science. Find collaborators. Network.
Join a conversationAdd your recorded webinar
Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.
Upload Now