Stability of diamond/Si bonding interface during device fabrication process

Published 2018 View Full Article

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Title
Stability of diamond/Si bonding interface during device fabrication process
Authors
Keywords
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Journal
Applied Physics Express
Volume 12, Issue 1, Pages 016501
Publisher
Japan Society of Applied Physics
Online
2018-11-26
DOI
10.7567/1882-0786/aaeedd

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