Fabrication of high-quality GaAs/diamond heterointerface for thermal management applications

标题
Fabrication of high-quality GaAs/diamond heterointerface for thermal management applications
作者
关键词
GaAs/diamond bonding interface, Interfacial structure, Heterointerface, Direct bonding, Power devices, Heat sink
出版物
DIAMOND AND RELATED MATERIALS
Volume 111, Issue -, Pages 108207
出版商
Elsevier BV
发表日期
2020-11-28
DOI
10.1016/j.diamond.2020.108207

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