Quasi-in-situ observation on diffusion anisotropy dominated asymmetrical growth of Cu-Sn IMCs under temperature gradient

Investigation of FeCoNiCu properties: thermal stability, corrosion behavior, wettability with Sn-3.0Ag-0.5Cu and interlayer formation of multi-element intermetallic compound

(2021) Yu-An Shen et al.   APPLIED SURFACE SCIENCE

Four Dimensional (4D) Microstructural Evolution of Cu6Sn5 Intermetallic and Voids under Electromigration in Bi-crystal Pure Sn Solder Joints

(2020) Marion Branch Kelly et al.   ACTA MATERIALIA

Improvement of thermomigration resistance in lead-free Sn3.5Ag alloys by Ag interlayer

(2020) Yu-Fang Lin et al.   JOURNAL OF ALLOYS AND COMPOUNDS

In-situ characterization of solidification and microstructural evolution during interrupted thermal fatigue in SAC305 and SAC105 solder joints using high energy X-ray diffraction and post-mortem EBSD analysis

(2020) Quan Zhou et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints

(2020) Xing Fu et al.   Materials

Double tricrystal nucleation behavior in Pb-free BGA solder joints

(2019) Jing Han et al.   MICROELECTRONICS RELIABILITY

Electromigration in Bi-crystal pure Sn solder joints: Elucidating the role of grain orientation

(2019) Marion Branch Kelly et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Interfacial microstructure evolution and shear strength of Sn0.7Cu–xNi/Cu solder joints

(2018) Yanqing Lai et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

(2018) Yulong Li et al.   Materials

Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps

(2018) Yu-An Shen et al.   MATERIALS LETTERS

Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition

(2017) Y. Zhong et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Electromigration anisotropy introduced by tin orientation in solder joints

(2017) Jian-Qiang Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

The growth behavior of interfacial intermetallic compound between Sn–3.5Ag–0.5Cu solder and Cu substrate under different thermal-aged conditions

(2017) Tao Xu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects

(2017) G. Ross et al.   MICROELECTRONICS RELIABILITY

Effect of Sn grain orientation on formation of Cu 6 Sn 5 intermetallic compounds during electromigration

(2017) Yu-An Shen et al.   SCRIPTA MATERIALIA

Full intermetallic joints for chip stacking by using thermal gradient bonding

(2016) T.L. Yang et al.   ACTA MATERIALIA

Dissolution and precipitation kinetics of Cu 6 Sn 5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient

(2016) N. Zhao et al.   INTERMETALLICS

Growth kinetic of Ag 3 Sn intermetallic compound in micro-scale Pb-free solder alloys under a temperature gradient

(2016) Fan-Yi Ouyang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Interfacial reaction of Ni3Sn4 intermetallic compound in Ni/SnAg solder/Ni system under thermomigration

(2016) Yi-Shan Yang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Design and performance of Ag nanoparticle-modified graphene/SnAgCu lead-free solders

(2016) Lianyong Xu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration

(2015) M.L. Huang et al.   ACTA MATERIALIA

Nucleation and Growth of Tin in Pb-Free Solder Joints

(2015) C. M. Gourlay et al.   JOM

In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging

(2015) Hailong Li et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints

(2015) G. Q. Wei et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient

(2015) N. Zhao et al.   Scientific Reports

Effects of anisotropic β-Sn alloys on Cu diffusion under a temperature gradient

(2014) Wei-Neng Hsu et al.   ACTA MATERIALIA

Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints

(2012) Ming-Yung Guo et al.   INTERMETALLICS

Thermomigration in solder joints

(2012) Chih Chen et al.   MATERIALS SCIENCE & ENGINEERING R-REPORTS

On the Asymmetric Growth Behavior of Intermetallic Compound Layers During Extended Reflow of Sn-Rich Alloy on Cu

(2012) Kyle E. Yazzie et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

(2012) H.-Y. Hsiao et al.   SCIENCE

Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn–3.5Ag solder joints

(2009) J.Y. Kim et al.   ACTA MATERIALIA

Thermomigration and electromigration in Sn58Bi solder joints

(2009) Xin Gu et al.   JOURNAL OF APPLIED PHYSICS

Thermomigration and electromigration in Sn58Bi ball grid array solder joints

(2009) X. Gu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effects of residual S on Kirkendall void formation at Cu/Sn–3.5Ag solder joints

(2008) Jin Yu et al.   ACTA MATERIALIA