标题
Nucleation and Growth of Tin in Pb-Free Solder Joints
作者
关键词
Solder Joint, Reaction Layer, Intermetallic Layer, Solder Ball, Coincidence Site Lattice Boundary
出版物
JOM
Volume 67, Issue 10, Pages 2383-2393
出版商
Springer Nature
发表日期
2015-08-18
DOI
10.1007/s11837-015-1582-6
参考文献
相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。- Metastable eutectic in Pb-free joints between Sn–3.5Ag and Ni-based substrates
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