Improvement of thermomigration resistance in lead-free Sn3.5Ag alloys by Ag interlayer

Effect of temperature on microstructural evolution of solder alloys under thermomigration

(2019) Tzy-Yang Lin et al.   JOURNAL OF APPLIED PHYSICS

Thermomigration in Co/SnAg/Co and Cu/SnAg/Co sandwich structure

(2019) Fan-Yi Ouyang et al.   MICROELECTRONICS RELIABILITY

Growth kinetic of Ag 3 Sn intermetallic compound in micro-scale Pb-free solder alloys under a temperature gradient

(2016) Fan-Yi Ouyang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Interfacial reaction of Ni3Sn4 intermetallic compound in Ni/SnAg solder/Ni system under thermomigration

(2016) Yi-Shan Yang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Interfacial Energy Effect on the Distribution of Ag3Sn in Full Intermetallic Joints

(2015) Ting-Li Yang et al.   ADVANCED ENGINEERING MATERIALS

Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigration

(2015) T.L. Yang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Asymmetrical Precipitation of Ag3Sn Intermetallic Compounds Induced by Thermomigration of Ag in Pb-Free Microbumps During Solid-State Aging

(2015) Yu-Ping Su et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of Ag3Sn: Effective suppression of thermomigration-induced Cu dissolution in micro-scale Pb-free interconnects

(2015) Wei-Neng Hsu et al.   MATERIALS CHEMISTRY AND PHYSICS

Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient

(2015) N. Zhao et al.   Scientific Reports

Effects of anisotropic β-Sn alloys on Cu diffusion under a temperature gradient

(2014) Wei-Neng Hsu et al.   ACTA MATERIALIA

Effects of silver addition on Cu–Sn microjoints for chip-stacking applications

(2014) T.L. Yang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effective suppression of electromigration-induced Cu dissolution by using Ag as a barrier layer in lead-free solder joints

(2013) Chao-hong Wang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints

(2012) Ming-Yung Guo et al.   INTERMETALLICS

Thermomigration in solder joints

(2012) Chih Chen et al.   MATERIALS SCIENCE & ENGINEERING R-REPORTS

Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints

(2011) Hsiao-Yun Chen et al.   JOURNAL OF MATERIALS RESEARCH

Experimental determination of thermal conductivity and solid–liquid interfacial energy of solid Ag3Sn intermetallic in the Sn–Ag–In ternary alloy

(2010) Y. Ocak et al.   INTERMETALLICS

Failure induced by thermomigration of interstitial Cu in Pb-free flip chip solder joints

(2008) Hsiao-Yun Chen et al.   APPLIED PHYSICS LETTERS