Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn–3.5Ag solder joints

标题
Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn–3.5Ag solder joints
作者
关键词
-
出版物
ACTA MATERIALIA
Volume 57, Issue 17, Pages 5001-5012
出版商
Elsevier BV
发表日期
2009-08-03
DOI
10.1016/j.actamat.2009.06.060

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