Full intermetallic joints for chip stacking by using thermal gradient bonding

标题
Full intermetallic joints for chip stacking by using thermal gradient bonding
作者
关键词
Chip stacking, Micro joints, Intermetallics, Solid-liquid interdiffusion bonding, Thermal gradient
出版物
ACTA MATERIALIA
Volume 113, Issue -, Pages 90-97
出版商
Elsevier BV
发表日期
2016-05-10
DOI
10.1016/j.actamat.2016.04.046

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