In-situ characterization of solidification and microstructural evolution during interrupted thermal fatigue in SAC305 and SAC105 solder joints using high energy X-ray diffraction and post-mortem EBSD analysis

On the 3-D Shape of Interlaced Regions in Sn-3Ag-0.5Cu Solder Balls

(2020) A. A. Daszki et al.   JOURNAL OF ELECTRONIC MATERIALS

Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7Cu-0.05Ni

(2018) J.W. Xian et al.   INTERMETALLICS

Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections

(2017) Z. L. Ma et al.   Nature Communications

Electromigration mechanisms in Sn-0.7Cu/Cu couples by four dimensional (4D) X-ray microtomography and electron backscatter diffraction (EBSD)

(2016) J.C.E. Mertens et al.   ACTA MATERIALIA

Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling

(2016) Quan Zhou et al.   JOURNAL OF ELECTRONIC MATERIALS

Nanoscale Three-Dimensional Microstructural Characterization of an Sn-Rich Solder Alloy Using High-Resolution Transmission X-Ray Microscopy (TXM)

(2016) Chandrashekara S. Kaira et al.   MICROSCOPY AND MICROANALYSIS

Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages

(2015) Bite Zhou et al.   JOURNAL OF ELECTRONIC MATERIALS

Effect of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Sn–Ag–Cu and Sn–Ag Solder Interconnects With and Without Board-Side Ni Surface Finish

(2014) Tae-Kyu Lee et al.   JOURNAL OF ELECTRONIC MATERIALS

Synchrotron Radiation Microtomography for Large Area 3D Imaging of Multilevel Microelectronic Packages

(2014) John W. Elmer et al.   JOURNAL OF ELECTRONIC MATERIALS

Reliability of lead-free solder joints in CSP device under thermal cycling

(2014) Liang Zhang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections. Part 1: Effects of Test Parameters

(2013) Jussi Hokka et al.   JOURNAL OF ELECTRONIC MATERIALS

Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections—Part 2: Failure Mechanisms

(2013) Jussi Hokka et al.   JOURNAL OF ELECTRONIC MATERIALS

In Situ Characterization of Twin Nucleation in Pure Ti Using 3D-XRD

(2013) Thomas R. Bieler et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Inhomogeneous deformation and microstructure evolution of Sn–Ag-based solder interconnects during thermal cycling and shear testing

(2012) Hongtao Chen et al.   MICROELECTRONICS RELIABILITY

In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders

(2011) Bite Zhou et al.   JOURNAL OF ELECTRONIC MATERIALS

The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

(2011) Thomas R. Bieler et al.   JOURNAL OF ELECTRONIC MATERIALS

Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue

(2011) Liang Yin et al.   JOURNAL OF ELECTRONIC MATERIALS

Cyclic twin nucleation in tin-based solder alloys

(2010) L.P. Lehman et al.   ACTA MATERIALIA

Electromigration in submicron interconnect features of integrated circuits

(2010) H. Ceric et al.   MATERIALS SCIENCE & ENGINEERING R-REPORTS

Influence of Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints

(2008) T.R. Bieler et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES