Growth kinetic of Ag 3 Sn intermetallic compound in micro-scale Pb-free solder alloys under a temperature gradient

标题
Growth kinetic of Ag 3 Sn intermetallic compound in micro-scale Pb-free solder alloys under a temperature gradient
作者
关键词
Intermetallic compound, Soldering, Diffusion, Growth kinetics, Thermomigration
出版物
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 655, Issue -, Pages 155-164
出版商
Elsevier BV
发表日期
2015-09-19
DOI
10.1016/j.jallcom.2015.09.151

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