Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration

出版年份 2015 全文链接

标题

作者

关键词

Electromigration, β-Sn grain orientation, Solder bump, Dissolution, Intermetallic compounds

出版物

Volume 100, Issue -, Pages 98-106

出版商

Elsevier BV

发表日期

2015-08-29

DOI

10.1016/j.actamat.2015.08.037

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