Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition

出版年份 2017 全文链接

标题

作者

关键词

Thermomigration, Synchrotron radiation, Temperature gradient, Interfacial reaction, Zn addition, Dissolution

出版物

Volume 695, Issue -, Pages 1436-1443

出版商

Elsevier BV

发表日期

2016-11-02

DOI

10.1016/j.jallcom.2016.10.280

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