Interfacial reaction of Ni3Sn4 intermetallic compound in Ni/SnAg solder/Ni system under thermomigration

出版年份 2016 全文链接

标题

作者

关键词

Pb-free solders, Ni, 3, Sn, 4, intermetallic compound, Metals and alloys, Diffusion, Liquid–solid reactions, Temperature gradient

出版物

Volume 674, Issue -, Pages 331-340

出版商

Elsevier BV

发表日期

2016-03-11

DOI

10.1016/j.jallcom.2016.03.020

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