The growth behavior of interfacial intermetallic compound between Sn–3.5Ag–0.5Cu solder and Cu substrate under different thermal-aged conditions

Evolution of microstructure and mechanical properties of Cu/SAC305/Cu solder joints under the influence of low ultrasonic power

(2017) Ai Ting Tan et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate

(2017) Ming Yang et al.   MATERIALS CHARACTERIZATION

Effects of surface diffusion and reaction-induced volume shrinkage on morphological evolutions of micro joints

(2017) H.W. Yang et al.   MATERIALS CHEMISTRY AND PHYSICS

Microstructural evolution and joint strength of Sn-58Bi/Cu joints through minor Zn alloying substrate during isothermal aging

(2016) Fengjiang Wang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Improving shear strength of Sn-3.0Ag-0.5Cu/Cu joints and suppressing intermetallic compounds layer growth by adding graphene nanosheets

(2016) Yilong Huang et al.   MATERIALS LETTERS

Microstructure evolution and shear fracture behavior of aged Sn3Ag0.5Cu/Cu solder joints

(2016) Xiaowu Hu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Experimental investigation of the failure mechanism of Cu–Sn intermetallic compounds in SAC solder joints

(2016) Chaoran Yang et al.   MICROELECTRONICS RELIABILITY

Low temperature bonding for high temperature applications by using SnBi solders

(2015) T.L. Yang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Formation and growth of intermetallic compound layers at the interface during laser soldering using Sn–Ag Cu solder on a Cu Pad

(2015) Hiroshi Nishikawa et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Microstructure, interfacial IMC and mechanical properties of Sn–0.7Cu–xAl (x=0–0.075) lead-free solder alloy

(2015) Li Yang et al.   MATERIALS & DESIGN

Growth behaviors of intermetallic compounds at Sn–3Ag–0.5Cu/Cu interface during isothermal and non-isothermal aging

(2013) Jun Shen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging

(2013) Xiaowu Hu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Texture evolution and its effects on growth of intermetallic compounds formed at eutectic Sn37Pb/Cu interface during solid-state aging

(2012) Ming Yang et al.   INTERMETALLICS

The critical oxide thickness for Pb-free reflow soldering on Cu substrate

(2012) C. Key Chung et al.   THIN SOLID FILMS

Grain growth sequence of Cu3Sn in the Cu/Sn and Cu/Sn–Zn systems

(2010) M.Y. Tsai et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni

(2010) S.C. Yang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders

(2009) Y.W. Wang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

(2008) Y.W. Wang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates

(2008) Y.W. Wang et al.   MICROELECTRONICS RELIABILITY