Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps

出版年份 2018 全文链接

标题

作者

关键词

Diffusion, Grain boundary, Grain orientation, Intermetallic compounds, Thermomigration

出版物

Volume 236, Issue -, Pages 190-193

出版商

Elsevier BV

发表日期

2018-10-20

DOI

10.1016/j.matlet.2018.10.112

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