Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate

Reconstruction and thermal performance analysis of die-bonding filling states for high-power light-emitting diode devices

(2014) Zongtao Li et al.   APPLIED THERMAL ENGINEERING

Numerical simulation of high power LED heat-dissipating system

(2014) Shih-Jeh Wu et al.   Electronic Materials Letters

Inhibition of Gold Embrittlement in Micro-joints for Three-Dimensional Integrated Circuits

(2014) W. L. Shih et al.   JOURNAL OF ELECTRONIC MATERIALS

Effects of metallic nanoparticle doped flux on the interfacial intermetallic compounds between lead-free solder ball and copper substrate

(2014) G.K. Sujan et al.   MATERIALS CHARACTERIZATION

Thermal and mechanical effects of voids within flip chip soldering in LED packages

(2014) Yang Liu et al.   MICROELECTRONICS RELIABILITY

High performance GaN-based flip-chip LEDs with different electrode patterns

(2014) Ray-Hua Horng et al.   OPTICS EXPRESS

Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering

(2014) Yang Liu et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

An 83% enhancement in the external quantum efficiency of ultraviolet flip-chip light-emitting diodes with the incorporation of a self-textured oxide mask

(2013) Kun-Ching Shen et al.   IEEE ELECTRON DEVICE LETTERS

Bump and Underfill Effects on Thermal Behaviors of Flip-Chip LED Packages: Measurement and Modeling

(2013) Ming-Yi Tsai et al.   IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY

Transient Analysis of Partial Thermal Characteristics of Multistructure Power LEDs

(2013) Chien-Ping Wang et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly

(2013) Sungeun Jeon   JOURNAL OF ELECTRONIC PACKAGING

Self-alignment of micro-parts using capillary interaction: Unified modeling and misalignment analysis

(2013) ShiQing Gao et al.   MICROELECTRONICS RELIABILITY

Modelling the self-alignment of passive chip components during reflow soldering

(2013) Olivér Krammer   MICROELECTRONICS RELIABILITY

Interfacial reactions between Sn–57Bi–1Ag solder and electroless Ni-P/immersion Au under solid-state aging

(2012) Christopher Fuchs et al.   JOURNAL OF MATERIALS SCIENCE

A study on the heat dissipation of high power multi-chip COB LEDs

(2012) Hsueh-Han Wu et al.   MICROELECTRONICS JOURNAL

Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging

(2011) Mike Powers et al.   JOURNAL OF ELECTRONIC MATERIALS

Heat sink performances of GaN/InGaN flip-chip light-emitting diodes fabricated on silicon and AlN submounts

(2011) Ming-Jer Jeng et al.   MICROELECTRONICS RELIABILITY

Increasing the reliability of solid state lighting systems via self-healing approaches: A review

(2011) Ugo Lafont et al.   MICROELECTRONICS RELIABILITY

A study of large area die bonding materials and their corresponding mechanical and thermal properties

(2011) Te-yuan Chung et al.   MICROELECTRONICS RELIABILITY

Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints

(2007) Jeong-Won Yoon et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING