Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints

Review on microstructure evolution in Sn–Ag–Cu solders and its effect on mechanical integrity of solder joints

(2013) Mrunali Sona et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

The bulk alloy microstructure and mechanical properties of Sn–1Ag–0.5Cu–xAl solders (x = 0, 0.1 and 0.2 wt. %)

(2012) Dhafer Abdul-Ameer Shnawah et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Solderability, IMC evolution, and shear behavior of low-Ag Sn0.7Ag0.5Cu-BiNi/Cu solder joint

(2012) Yang Liu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low‐Ag Sn‐Ag‐Cu solder joints

(2012) Dhafer Abdul Ameer Shnawah et al.   MICROELECTRONICS INTERNATIONAL

Effect of soldering condition on formation of intermetallic phases developed between Sn–0.3Ag–0.7Cu low-silver lead-free solder and Cu substrate

(2011) Niwat Mookam et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates

(2011) H.R. Kotadia et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys

(2011) Fangjie Cheng et al.   JOURNAL OF MATERIALS SCIENCE

Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing

(2011) Yanhong Tian et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering

(2010) L.C. Tsao   JOURNAL OF ALLOYS AND COMPOUNDS

A review of mechanical properties of lead-free solders for electronic packaging

(2009) Hongtao Ma et al.   JOURNAL OF MATERIALS SCIENCE