Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints

Published 2018 View Full Article

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Title
Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints
Authors
Keywords
ENImAg, Sn-Ag-Cu, Reflow soldering, Isothermal aging, Intermetallic compound
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 740, Issue -, Pages 958-966
Publisher
Elsevier BV
Online
2018-01-07
DOI
10.1016/j.jallcom.2018.01.054

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