Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates

Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints

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Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient

(2018) Guang Chen et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effect of Ag 3 Sn nanoparticles and temperature on Cu 6 Sn 5 IMC growth in Sn-xAg/Cu solder joints

(2018) Bingfeng Guo et al.   MATERIALS RESEARCH BULLETIN

Interfacial reactions between Cu and Zn20Sn solder doped with minor RE

(2017) Jun Tian et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn–0.7Cu solder joints

(2017) Shuang Tian et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene

(2016) Yong-Ho Ko et al.   ACS Applied Materials & Interfaces

Sn–3.0Ag–0.5Cu nanocomposite solders reinforced by graphene nanosheets

(2016) Yilong Huang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Microsupercapacitors as miniaturized energy-storage components for on-chip electronics

(2016) Nana Amponsah Kyeremateng et al.   Nature Nanotechnology

Graphene-Based Hybrid Composites for Efficient Thermal Management of Electronic Devices

(2015) Michael Shtein et al.   ACS Applied Materials & Interfaces

Miniaturized Flexible Electronic Systems with Wireless Power and Near-Field Communication Capabilities

(2015) Jeonghyun Kim et al.   ADVANCED FUNCTIONAL MATERIALS

Effects of graphene nanosheets on interfacial reaction of Sn–Ag–Cu solder joints

(2015) Lianyong Xu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate

(2015) Yang Liu et al.   JOURNAL OF ELECTRONIC MATERIALS

Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging

(2014) Yang Liu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints

(2014) Yang Liu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effect of graphene doping on microstructural and mechanical properties of Sn–8Zn–3Bi solder joints together with electromigration analysis

(2013) Xiao Hu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Solderability, IMC evolution, and shear behavior of low-Ag Sn0.7Ag0.5Cu-BiNi/Cu solder joint

(2012) Yang Liu et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Oxidation Resistance of Graphene-Coated Cu and Cu/Ni Alloy

(2011) Shanshan Chen et al.   ACS Nano

Diffusion Barrier Characteristics of Electroless Co(W,P) Thin Films to Lead-Free SnAgCu Solder

(2011) Hung-Chun Pan et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Interaction behavior between the additives and Sn in Sn–3.0Ag–0.5Cu-based solder alloys and the relevant joint solderability

(2008) Fangjie Cheng et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu

(2008) Y.W. Wang et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Growth kinetics of intermetallic compounds and tensile properties of Sn–Ag–Cu/Ag single crystal joint

(2007) Hefei Zou et al.   JOURNAL OF ALLOYS AND COMPOUNDS