Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient

Microstructures and properties of new Sn–Ag–Cu lead-free solder reinforced with Ni-coated graphene nanosheets

(2016) Guang Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

(2015) Srivalli Chellvarajoo et al.   MATERIALS & DESIGN

Effect of ageing time on the tensile behavior of Sn–3.5wt% Ag–0.5wt% Cu (SAC355) solder alloy with and without adding ZnO nanoparticles

(2015) M. Sobhy et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder

(2015) Guang Chen et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effect of graphene doping on microstructural and mechanical properties of Sn–8Zn–3Bi solder joints together with electromigration analysis

(2013) Xiao Hu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

A review: influence of nano particles reinforced on solder alloy

(2013) Ervina Efzan Mhd Noor et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Retarding Electromigration in Lead-Free Solder Joints by Alloying and Composite Approaches

(2012) Ran Zhao et al.   JOURNAL OF ELECTRONIC MATERIALS

Thermomigration in solder joints

(2012) Chih Chen et al.   MATERIALS SCIENCE & ENGINEERING R-REPORTS

Microstructure and tensile properties of Sn–1Cu lead-free solder alloy produced by directional solidification

(2012) Xiaowu Hu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

In situ observation of thermomigration of Sn atoms to the hot end of 96.5Sn-3Ag-0.5Cu flip chip solder joints

(2011) Fan-Yi Ouyang et al.   JOURNAL OF APPLIED PHYSICS

Development of SnAg-based lead free solders in electronics packaging

(2011) Liang Zhang et al.   MICROELECTRONICS RELIABILITY

Effect of alloying elements on properties and microstructures of SnAgCu solders

(2010) Lili Gao et al.   MICROELECTRONIC ENGINEERING

Low temperature electromigration and thermomigration in lead-free solder joints

(2009) Cemal Basaran et al.   MECHANICS OF MATERIALS

Research advances in nano-composite solders

(2008) J. Shen et al.   MICROELECTRONICS RELIABILITY