Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn–0.7Cu solder joints
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Title
Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn–0.7Cu solder joints
Authors
Keywords
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Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 28, Issue 21, Pages 16120-16132
Publisher
Springer Nature
Online
2017-07-31
DOI
10.1007/s10854-017-7512-3
References
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