Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging

Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn–Ag–Cu lead-free solders

(2014) A.A. El-Daly et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Evolution of microstructure, thermal and creep properties of Ni-doped Sn–0.5Ag–0.7Cu low-Ag solder alloys for electronic applications

(2013) A.E. Hammad   MATERIALS & DESIGN

Microstructure and electrical mechanism of Sn–xAg–Cu PV-ribbon for solar cells

(2013) Kuan-Jen Chen et al.   MICROELECTRONIC ENGINEERING

Fe addition to Sn-3.5Ag solder for the suppression of Kirkendall void formation

(2013) S.H. Kim et al.   SCRIPTA MATERIALIA

A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low‐Ag Sn‐Ag‐Cu solder joints

(2012) Dhafer Abdul Ameer Shnawah et al.   MICROELECTRONICS INTERNATIONAL

Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu6Sn5

(2012) Y.Q. Wu et al.   SCRIPTA MATERIALIA

Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni–P substrates

(2011) H.R. Kotadia et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging

(2011) P.J. Shang et al.   PHILOSOPHICAL MAGAZINE LETTERS

Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering

(2010) L.C. Tsao   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage

(2009) M. Berthou et al.   MICROELECTRONICS RELIABILITY

Intermetallic Formation of Copper Pillar With Sn–Ag–Cu for Flip-Chip-On-Module Packaging

(2008) Mark Huang et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP

(2008) F. Sun et al.   MICROELECTRONICS RELIABILITY