The growth and roughness evolution of intermetallic compounds of Sn–Ag–Cu/Cu interface during soldering reaction

Published 2007 View Full Article

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Title
The growth and roughness evolution of intermetallic compounds of Sn–Ag–Cu/Cu interface during soldering reaction
Authors
Keywords
-
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 458, Issue 1-2, Pages 542-547
Publisher
Elsevier BV
Online
2007-04-17
DOI
10.1016/j.jallcom.2007.04.047

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