Experimental and computational investigation of low temperature Cu Sn solid-state-diffusion bonding for 3D integration

Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter

(2016) Yingxia Liu et al.   ACTA MATERIALIA

Activation of electroplated-Cu surface via plasma pretreatment for low temperature Cu-Sn bonding in 3D interconnection

(2016) Junqiang Wang et al.   APPLIED SURFACE SCIENCE

Electromigration in 3D-IC scale Cu/Sn/Cu solder joints

(2016) Cheng-En Ho et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructural and mechanical analysis on Cu–Sn intermetallic micro-joints under isothermal condition

(2015) L. Mo et al.   INTERMETALLICS

Fine pitch Cu/Sn solid state diffusion bonding for advanced three-dimensional chip stacking

(2015) Wenqi Zhang   JAPANESE JOURNAL OF APPLIED PHYSICS

Solid-state reaction of electroplated thin film Au/Sn couple at low temperatures

(2015) H. Xu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Perpendicular Growth Characteristics of Cu-Sn Intermetallic Compounds at the Surface of 99Sn-1Cu/Cu Solder Interconnects

(2015) Zhiwen Chen et al.   JOURNAL OF ELECTRONIC MATERIALS

Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40μm pitch Cu-pillar/Sn–Ag bump interconnection

(2015) Ji-Won Shin et al.   MICROELECTRONICS RELIABILITY

Bewlay, Gradečak, Heilshorn, Spolenak, and Venkatesan to chair 2016 MRS Fall Meeting

(2015)   MRS BULLETIN

Chip to Chip Bonding Using Cu Bumps Capped with Thin Sn Layers and the Effect of Microstructure on the Shear Strength of Joints

(2014) Yang Ho Kim et al.   JOURNAL OF ELECTRONIC MATERIALS

Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration

(2014) John H. Lau   JOURNAL OF ELECTRONIC PACKAGING

Growth kinetics of the Cu3Sn phase and void formation of sub-micrometre solder layers in Sn–Cu binary and Cu–Sn–Cu sandwich structures

(2013) Qingqian Li et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Optimized Cu-Sn Wafer-Level Bonding Using Intermetallic Phase Characterization

(2013) Thi-Thuy Luu et al.   JOURNAL OF ELECTRONIC MATERIALS

Phase transformation and grain orientation of Cu–Sn intermetallic compounds during low temperature bonding process

(2013) Chunjin Hang et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Phase-field simulations of intermetallic compound growth in Cu/Sn/Cu sandwich structure under transient liquid phase bonding conditions

(2012) M.S. Park et al.   ACTA MATERIALIA

High-Density Large-Area-Array Interconnects Formed by Low-Temperature Cu/Sn–Cu Bonding for Three-Dimensional Integrated Circuits

(2012) M. R. Lueck et al.   IEEE TRANSACTIONS ON ELECTRON DEVICES

The Cu–Sn phase diagram, Part I: New experimental results

(2012) S. Fürtauer et al.   INTERMETALLICS

Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP)

(2012) John H. Lau et al.   MICROELECTRONICS RELIABILITY

Concurrent nucleation, formation and growth of two intermetallic compounds (Cu6Sn5 and Cu3Sn) during the early stages of lead-free soldering

(2011) M.S. Park et al.   ACTA MATERIALIA

Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System

(2011) A. Paul et al.   METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE

Low temperature bonding technology for 3D integration

(2011) Cheng-Ta Ko et al.   MICROELECTRONICS RELIABILITY

Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect

(2010) L.D. Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Interfacial Reaction Effect on Electrical Reliability of Cu Pillar/Sn Bumps

(2010) Myeong-Hyeok Jeong et al.   JOURNAL OF ELECTRONIC MATERIALS

SnAg Microbumps for MEMS-Based 3-D Stacks

(2009) R. Johannessen et al.   IEEE TRANSACTIONS ON ADVANCED PACKAGING

Kinetics of reactive diffusion between Pd–Ag alloys and Sn at solid-state temperatures

(2008) T. Sakama et al.   JOURNAL OF ALLOYS AND COMPOUNDS