Low temperature and pressureless Cu-to-Cu direct bonding by green synthesized Cu nanoparticles
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Title
Low temperature and pressureless Cu-to-Cu direct bonding by green synthesized Cu nanoparticles
Authors
Keywords
Cu nanoparticle synthesis, Green chemistry, Cu oxide reduction, Sintering, Low temperature bonding, Power electronic packaging
Journal
Journal of the Taiwan Institute of Chemical Engineers
Volume 125, Issue -, Pages 394-401
Publisher
Elsevier BV
Online
2021-06-26
DOI
10.1016/j.jtice.2021.06.026
References
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