High lead solder (over 85 %) solder in the electronics industry: RoHS exemptions and alternatives

Die Attach Materials for High Temperature Applications: A Review

(2011) V R Manikam et al.   IEEE Transactions on Components Packaging and Manufacturing Technology

Shear strength of the Zn–Sn high-temperature lead-free solders

(2010) R. Mahmudi et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Effect of alloying elements on the creep behavior of high Pb-based solders

(2010) Harry Schoeller et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

High-temperature lead-free solder alternatives

(2010) Vivek Chidambaram et al.   MICROELECTRONIC ENGINEERING

Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier

(2009) Seongjun Kim et al.   JOURNAL OF ELECTRONIC MATERIALS

Investigation of rare earth-doped BiAg high-temperature solders

(2009) Yaowu Shi et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Die-attachment solutions for SiC power devices

(2009) R. Kisiel et al.   MICROELECTRONICS RELIABILITY

Interfacial Reaction and Die Attach Properties of Zn-Sn High-Temperature Solders

(2008) Seongjun Kim et al.   JOURNAL OF ELECTRONIC MATERIALS